What is Cu clip package? tracer wire

Power chips are connected to exterior circuits via packaging, and their efficiency relies on the assistance of the product packaging. In high-power scenarios, power chips are usually packaged as power components. Chip interconnection describes the electrical connection on the upper surface of the chip, which is usually light weight aluminum bonding cable in standard components. ^
Conventional power module bundle cross-section

Presently, business silicon carbide power modules still primarily utilize the product packaging innovation of this wire-bonded traditional silicon IGBT module. They encounter issues such as large high-frequency parasitic parameters, insufficient warm dissipation capacity, low-temperature resistance, and not enough insulation toughness, which limit using silicon carbide semiconductors. The screen of outstanding performance. In order to solve these issues and fully make use of the substantial prospective advantages of silicon carbide chips, many new product packaging technologies and solutions for silicon carbide power modules have arised in the last few years.

Silicon carbide power component bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually established from gold cable bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually created from gold wires to copper wires, and the driving force is expense decrease; high-power tools have actually developed from aluminum cables (strips) to Cu Clips, and the driving pressure is to boost item efficiency. The higher the power, the higher the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that uses a solid copper bridge soldered to solder to attach chips and pins. Compared with typical bonding product packaging approaches, Cu Clip innovation has the adhering to benefits:

1. The connection in between the chip and the pins is constructed from copper sheets, which, to a certain degree, replaces the typical cord bonding method between the chip and the pins. As a result, an unique bundle resistance value, higher current flow, and much better thermal conductivity can be obtained.

2. The lead pin welding location does not need to be silver-plated, which can totally save the cost of silver plating and poor silver plating.

3. The product appearance is totally constant with normal products and is mainly utilized in servers, mobile computers, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.

Cu Clip has two bonding techniques.

All copper sheet bonding technique

Both the Gate pad and the Source pad are clip-based. This bonding approach is extra expensive and complex, however it can achieve much better Rdson and better thermal impacts.

( copper strip)

Copper sheet plus wire bonding method

The resource pad uses a Clip method, and eviction makes use of a Cord method. This bonding method is somewhat less costly than the all-copper bonding method, conserving wafer area (relevant to very tiny gateway locations). The procedure is easier than the all-copper bonding method and can obtain far better Rdson and much better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding tracer wire, please feel free to contact us and send an inquiry.

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